Space-Grade QPro• FPGAs
Virtex-4QV FPGAs Virtex-II XQR FPGAs Virtex XQR FPGAs
Part Number XQR4VLX200 XQR4VSX55 XQR4VFX60 XQR4VFX140 XQR2V3000 XQVR300 XQVR600
Core Voltage 1.2V 1.2V 1.2V 1.2V 1.5V 2.5V 2.5V
Slices (1) 89,088 24,576 25,280 63,168 14,336 3,072 6,912
Logic Cells 200,448 55,296 56,880 142,128 32,256 6,912 15,552
Logic Resources
CLB Flip-Flops 178,176 49,152 50,560 126,336 28,672 6,144 13,824
Maximum Distributed RAM (Kbits) 1,392 384 395 987 448 1,711 3,523
Block RAM/FIFO w/ECC (18Kbits each) 336 320 232 552 96 – –
Memory Resources
Total Block RAM (Kbits) 6,048 5,760 4,176 9,936 1,728 64 96
Clock Resources Digital Clock Manager (DCM) 12 8 12 20 12 4 4
Maximum Single-Ended I/Os 960 640 576 896 720 316 316
Maximum Differential I/O Pairs 480 320 224 448 360 – –
I/O Resources
Digitally Controlled Impedance YES YES YES YES YES – –
DSP Slices 96 512 128 192 – – –
18 x 18 Multipliers – – – – 96 – –
Embedded Hard
IP Resources
10/100/100 Ethernet MAC Blockset – – 4 4 – – –
PowerPC ® Processor Blockss – – 2 2 – – –
Speed Grades -10 -10 -10 -10 -4 -4 -4
Configuration Memory (Mbits) 51.4 22.7 21.0 47.9 10.5 1.7 3.5
Manufacturing Grades V V V V M, V M, V, B M, V, B
Miscellaneous
Total Ionizing Dose (krad) 300 300 300 300 200 100 100
SEL Immunity (MeV-cm2/mg) >125 >125 >125 >125 >160 >125 >125
Fourth Quarter 2009 Xcell Journal 65
Package (2) Area Available User I/Os
CGA Packages (CG): ceramic column grid array (1.27 mm ball spacing)
CG717 (3) 35 x 35 mm 516
CFA Packages (CF): flip-chip ceramic column grid array (1.0 mm ball spacing)
CF1144 (4) 35 x 35 mm 576
CF1140 (5) 35 x 35 mm 640
CF1509 (6) 40 x 40 mm 960 768
CQFP Packages (CB): ceramic brazed quad flat pack (0.025 inch lead spacing)
CB228 1.55 x 1.55 in 162 162
Notes: 1. Each slice comprises two 4-input logic function generators (LUTs), two storage elements, wide-function multiplexers, and carry logic. 2. For information on DSCC SMD availability contact Xilinx .
3. The BG728 and CG717 packages are footprint / pin compatible. 4. The CF1144 and FF1152 packages are footprint / pin compatible. 5. The CF1140 and FF1148 packages are footprint / pin
compatible. 6. For the XQR4VLX200, the CF1509 and FF1513 packages are footprint / pin compatible. For the XQR4VFX140, the CF1509 and the FF1517 are footprint / pin compatible.
Manufacturing Grades
http://www.xilinx.com/products/milaero/rpt003.pdf
Grade Description Temperature
V QPro Radiation Hardened QML Class V Military Ceramic Tc = -55C to +125C
H QPro Flip-Chip Radiation Tolerant Ceramic Tj = -55C to +125C
B SMD Radiation Tolerant and Non-RT SMD Military Ceramic Tc = -55C to +125C
N Military Plastic Tj = -55C to +125C
M Military Ceramic or Plastic Tj = -55C to +125C (Plasttic), Tj = -55C to +125C (Ceramic)
I Industrial Plastic Tj = -40C to +100C
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